Self-Contained Semi-Active Cooling Mechanism for Very High Power Density Integrated Circuits and Electronic Modules Using a Reversible Endothermic Chemical Reaction

Reference #:

2005-026

Inventors/Contributors

Barry K. Gilbert, Ph.D., Wendy L. Wilkens

Description

This invention is a completely self-contained and encapsulated "package" into which a high power integrated circuit ("chip") such as an amplifier, or an entire subsystem (such as a radar "transmit-receive" module), can be installed to provide the necessary thermal and electrical environment to assure that the chip or multi-chip subsystem works correctly. The packaging approach not only assures that DC electrical power will be delivered to the chip(s) and AC signals will be brought into and led from the chip(s) in a correct manner, but also that the operating temperature of the chip(s) will remain below their maximum survivable operating temperature. This packaging approach is especially suitable for very high power density chips that operate at dissipation levels exceeding 100 Watts per square centimeter.

Patent Status

Pending